Supermicro

High density 8U system with NVIDIA® HGX™ H100 8-GPU Highest GPU communication using NVIDIA® NVLINK™ + NVIDIA® NVSwitch™ 8 NIC for GPU direct RDMA (1:1 GPU Ratio) 24 DIMM Slots; Up to 6TB DRAM; 4800 ECC DDR5 LRDIMM;RDIMM; 8 PCIe Gen 5.0 X16 LP, and up to 4 PCIe Gen 5.0 X16 FHFL Slots Flexible networking options

1. Acoustically optimized for quiet operation Closed-loop liquid cooling for CPUs and GPUs 2. 4 liquid-cooled NVIDIA A100 GPUs with NVIDIA® NVLink™ (2+2) installed 3. Dual 4th Gen Intel® Xeon® Scalable Processors, 6444Y (16 cores at 3.6Ghz) installed 4. Dual-port active-cooled NVIDIA Connect-X6 Dx 25G Network Adapter installed 5. Supermicro Cloud Orchestrator AI software stack

1. 20 High performance DP blade servers in a 8U High blade enclosure 2. Liquid cooling support 3. PCIe Gen. 4 ready for SSD and Network IO 4. InfiniBand 200G HDR support 5. Front Access Design - front-loading nodes, HDD/SSD hot-swap and management 6. Security enhancement from booting to management

1.20 High performance UP blade servers in a 8U High blade enclosure 2.Blade AIOM Card support 3.PCI-E Gen4 ready for SSD and Network IO 4.InfiniBand 200G HDR support 5.Front Access Design - front-loading nodes, HDD/SSD hot-swap, management and network IO 6.Security enhancement from booting to management

X10 4U72 Ceph data node w/360TB volume and SSD.

X10 4U72 Ceph data node w/432TB volume . No SSD.

1. Intel® Xeon® Processor D-2191I, 18-Cores, 36 Threads 2. 2x 3.5" SATA3 by default; 2x 2.5" hybrid SATA3/NVMe w/ Optional kits 3. Up to 512GB ECC LRDIMM, Up to 256GB ECC RDIMM, up to DDR4-2400MHz; in 4 DIMM slots 4. 2 GbE LAN ports via Intel i350 5. 1 Centralized IPMI management port 6. 1 PCI-E 3.0 x16 (low-profile), 1 Micro-LP, and 2 M.2 7. 2 USB 2.0, 1 VGA, 1 COM port, (with KVM dongle) 8. 4 heavy duty hot-swap 8cm fans with optimal cooling zone (per system) 9. 1600W Redundant power supplies Titanium Level Certified (per system)

Dual Intel® Xeon® 3rd Gen Scalable Processors (Ice Lake) TDP up to 270W Intel® C621A Chipset 32x DIMM slots, up to 8TB Registered ECC DDR4 3200MHz SDRAM 2x PCIe 4.0 x16 FHFL slot and 2x PCIe 4.0 x8 FHFL slot 6x 400GbE QSFP-DD for scale-out and 1x 1GbE BaseT (dedicated IPMI port) 4x 2.5”NVMe Hot-Swap Drive Bays Up to 16x 2.5" SATA Hot-Swap Drive Bays (Additional SAOC is required) Up to 8x 2.5" SATA Hot-Swap Drive Bays 12x Removable Heavy-Duty FANs (Includes 2x Dummy PSU FAN) 6x 3000W(54V+12V) Redundant Power Supplies, Titanium Level

2x Intel Xeon E5-2630 v2 128GB memory per node 6x 2.5in 400GB SSD Hard Drives 30x 3.5in 4TB SATA3 HDDs Internal 2.5in OD drives (mirrored 80GB SSD) 4x 10G SFP+ via 2x AOC-STGN-I2S

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 16 PCI-E 3.0 x16 for RDMA via IB EDR; 2 PCI-E 3.0 x16 on board 4. Supports 16 V100 SXM3 350W GPUs with NVSwitch and NVLink 5. Dual 10GBase-T LAN with Intel® X540 6. 16 Hot-swap 2.5" NVMe drives, 6 Hot-swap 2.5" SATA3 drive bays 7. 6x 80mm Hot-swap PWM Fans, 8x 92mm Hot-swap Fans 8. 6x 3000W Redundant Power Supplies; Titanium Level (96%+)

392 UP nodes per 42U Rack 28 UP nodes in 3U Per blade supports Intel® Xeon® processor E-2100, E-2200 series Per blade support up to 64GB DDR4 memory Per blade support up to 2.5" NVMe drives Per System supports 10GbE LAN and two switch modules for redundancy

32 DIMM slots Up to 8TB: 32x 256 GB DRAM Memory Type: 4800MHz ECC DDR5 8 PCIe Gen 5.0 X16 LP, 2 PCIe Gen 5.0 X16 FHFL Slots Flexible networking options 12x 2.5" Hot-swap NVMe drive bays 2 M.2 NVMe for boot drive only 8x 2.5" Hot-swap SATA drive bays 10 heavy duty fans with optimal fan speed control 6x 3000W (3+3) Redundant Power Supplies, Titanium Level Optional: 8x 3000W (4+4) Redundant Power Supplies, Titanium Level