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1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8, 1 SIOM card support (flexible networking) Note: must bundle with Network card

Single Socket E (LGA-4677) 5th/4th Gen Intel® Xeon® Scalable processor. Up to 300W TDP. 16 ECC DDR5-5600: LRDIMM/RDIMM Two Dedicated PCIe 5.0 x16 AIOM slots (OCP 3.0 SFF compliant) Up to 6x PCIe 5.0 Slots (Slot #2 populated by 3908 controller by default) Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN per node

Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 4. SIOM for flexible networking options

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family (up to 160W TDP) 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24x DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 4. SIOM for flexible networking options 5. 60x 3.5" Hot-swap SAS3/SATA3 drive bays; 2x 2.5" rear Hot-swap SATA drive bays; optional 6 NVMe bays 6. Broadcom 3108 SAS3 HW RAID controller 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 5x 8cm hot-swap redundant PWM fans PWM fans 9. 2000W Redundant Power Supplies Titanium Level (96%) Certified 10. Front 3.5" LCD display

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family (up to 160W TDP) 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 4. SIOM for flexible networking options 5. 45 Hot-swap 3.5" SAS3/SATA3 drive bays; 2 rear Hot-swap 2.5" SATA drive bays; optional 6 NVMe bays 6. Broadcom 3008 SAS3 IT mode controller 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 5 hot-swap 8cm redundant PWM fans PWM fans 9. 1600W Redundant Power Supplies Platinum Level (94%+) Certified 10. Front 3.5" LCD display

1. Dual Node (HA), Enterprise High Availability (SBB) Architecture (shared storage); Fully serviceable and redundant Two hot-pluggable systems (nodes) in a 4U form factor. Each node supports the following: 2. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 3. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 4. 2 PCI-E 3.0 x16 (HHHL), 1 PCI-E 3.0 x8 (HHHL) 5. 60x 3.5"/2.5" Hot-swap SAS3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 22110) 6. Dual Broadcom 3616 IT Mode 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 9. 2600W Redundant Power Supplies Titanium Level (96%) 10. Dedicated node to node connectivity featuring high performance NTB PCI-E 3.0 x16 , 1G private Ethernet, and IPMI for robust node fail-over support

Single Socket E (LGA-4677) 5th/4th Gen Intel® Xeon® Scalable processor. Up to 300W TDP. 16 ECC DDR5-5600: LRDIMM/RDIMM Two Dedicated PCIe 5.0 x16 AIOM slots (OCP 3.0 SFF compliant) Up to 6x PCIe 5.0 Slots (Slot #2 populated by 3908 controller by default) Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN per node

1. Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors. Up to 270W TDP. 2. 8 DIMMs; Supports 3DS DDR4-3200: RDIMM/LRDIMM/Intel® Intel® DCPMM 3. 2 PCIe 4.0 x16 (LP) slots, 2 PCIe 4.0 x8 (LP) slots 4. Intel® Ethernet Controller X550 2x 10GbE RJ45 5. Redundant Titanium 1600W Power Supply

Dual socket 3rd Gen Intel® Xeon® Scalable processors, up to 72 Cores 16 ECC DDR4-3200: LRDIMM/RDIMM 3 x PCI-E 4.0 x16 HHHL PCI-E slots 60 3.5"/2.5" Hot-swap SAS3/SATA3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 2280 and 22110) 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 2000W Redundant Power Supplies Titanium Level (96%) Drive Controller support via Broadcom® 3916 or 3616 Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN

1. Intel® Xeon® processor D-2146NT, 8-Core, 16 Threads, 80W 2. 12 Hot-swap 3.5" SATA3 bays; SAS3 supported by AOC 3. 1 PCI-E 3.0 x16 (FH) slot; 1 M.2 slot M key and 1 B Key 4. Up to 512GB ECC LRDIMM, up to 256GB reg. ECC RDIMM DDR4-2133Mz; in 4 DIMM slots

1. Single socket FCBGA 1283 supports Intel® Atom® processor C2750 2. System on Chip 3. 12x 3.5" Hot-swap HDD bays 4. Up to 64GB Unbuffered ECC/non-ECC DDR3 1600MHz in 4x DIMM slots 5. 1x PCI-E 2.0 x4 (in x8, LP, HL) 6. Dual GbE LAN ports with SoC 7. Integrated IPMI 2.0 and KVM with Dedicated LAN 8. I/O ports: IPMI, 2x GbE, VGA 9. 400W High-efficiency redundant short depth Power Supplies

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24x DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 4. SIOM for flexible networking options