4 GPU

Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors Intel® C621A Chipset 32 DIMM Slots; Up to 8TB DRAM; Up to 8TB Intel® Optane™ Persistent Memory (up to 12TB with DRAM); 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM; Intel® Optane™ Persistent Memory 200 series 10 PCI-E Gen 4.0 X16 LP Slots AIOM/OCP 3.0 Support Flexible networking options 2 M.2 NVMe and SATA 6x 2.5" Hot-swap NVMe/SATA/SAS drive bays 4 heavy duty fans with optimal fan speed control 4x 2200W redundant Titanium level power supplies

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 4 PCI-E 3.0 x16 (LP) (GPU tray for GPUDirect RDMA), 2 PCI-E 3.0 x16 (LP, CPU tray) 4. Support 8 Tesla V100 with 300GB/s NVLINK 5. Dual 10GBase-T LAN with Intel® X540 6. 16 Hot-swap 2.5" SAS/SATA drives (Optional 8x NVMe drives supported), 2 NVMe based M.2 SSD 7. 8x 92mm cooling fans 8. 2200W Redundant (2+2) Power Supplies; Titanium Level (96%+)

32 DIMM Slots; Up to 8TB DRAM; Up to 8TB Intel® Optane™ Persistent Memory (up to 12TB with DRAM); 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM; Intel® Optane™ Persistent Memory 200 series 4x PCI-E Gen 4.0 X16 LP Slots Flexible networking options 4x 2.5" Hot-swap SATA drive bays 4 heavy duty fans with optimal fan speed control 2x 3000W redundant Titanium level power supplies

Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16 DIMM slots. 4 PCI-E 3.0 x16 slots 2 PCI-E 3.0 x8 (1 in x16) slots support Thunderbolt 2.0 AOC, 1 PCI-E 2.0 x4 (in x8) slot; Up to 4 NVIDIA® GPU. I/O ports: 1 VGA, 2 COM, 2 GbE, 10 USB 2.0, & 1 IPMI Dedicated LAN. 8 Hot-swap 3.5", 3 Fixed 5.25" and 1 Fixed 3.5" Drive Bays. 4 Heavy Duty Fans, 2 Exhaust Fans, and 2 Active Heatsink with Optimal Fan Speed Control. 2000W High efficiency (96%) Redundant PSU; Titanium Level. Tower or Rackmount GPU Kit for passive GPU/Xeon Phi support (MCP-320-74701-0N-KIT).

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24x DIMM slots 3. Expansion slots, Single Root Complex, 11 PCI-E 3.0 x16 (FH, FL) slots

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16 DIMM slots 3. 4 PCI-E 3.0 x16 slots (GPU/MIC, opt.), 1 PCI-E 3.0 x8 (in x16) low-profile slot

Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors Intel® C621A Chipset 32 DIMM Slots; Up to 8TB DRAM; 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM 4U system with NVIDIA® HGX™ A100 4-GPU 6 PCI-E Gen 4.0 X16 LP Slots Highest GPU communication using NVIDIA® NVLINK™ Supports HGX A100 4-GPU 40GB (HBM2) or 80GB (HBM2e)

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 3. 4x PCI-E 3.0 x16 slots (4x GPU/ Xeon Phi cards opt.), 2x PCI-E 3.0 x8 (in x16) LP slot