Storage Solutions

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 3. 2 PCI-E 3.0 x16 (FHHL) slots 4. 10 Hot-swap 2.5" SAS/SATA HDD bays (default 8 SATA3, 2 NVMe or SATA2) 5. Intel® X540 Dual port 10GBase-T LAN 6. I/O ports: 2 SuperDOM, 1 VGA, 1 COM, 2 USB 3.0 (front), 4 USB 2.0 (rear) 7. 2 SuperDOM (Disk on Module) ports 8. 700W Redundant Power Supplies Platinum Level High-efficiency

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 3. 1 PCI-E 3.0 x16, 6 PCI-E 3.0 x8 (slot 1 & 2 occupied by controller and JBOD expansion port) 4. Dual 10GBase-T LAN w/ Intel® X540 5. 36x 3.5" Hot-swap drive bays (24 front + 12 rear): 32x 3.5" Hot-swap SAS3/SATA3 drive bays and 4x NVMe hybrid drive bays (SAS3/SATA3/NVMe*); 2x 2.5" optional Hot-swap SATA drive bays (rear); 4x 2.5" internal fixed drive bays 6. SAS3 via Broadcom 3008 controller; IT mode 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 7x 80mm middle cooling fans 9. 1280W Redundant Power Supplies Platinum Level (94%)

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24 DIMM slots 3. 7 PCI-E 3.0 x8 slots (5 FH, 10.5" L, 1 LP, 1 Internal LP) 4. 2x 10GBase-T ports

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8

1. Single AMD EPYC™ 7000-Series Processor 2. Up to 2TB Registered ECC DDR4 2666MHz SDRAM in 16 DIMMs 3. Expansion slots: 2 PCI-E 3.0 x16 (FH/HL) slots, 1 PCI-E 3.0 x16 (LP) slot M.2 Interface: PCI-E 3.0 x2 (NVMe based) M.2 Form Factor: 2280, 22110 M.2 Key: Onboard M-key Number of M.2: 2

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24 DIMM slots 3. 7 PCI-E 3.0 x8 slots (5 FH, 10.5" L, 1 LP, 1 Internal LP) 4. 2x 10GBase-T ports 5. 12 Hot-swap 3.5" Drive Bays: Default 8 SATA3 ports, 4 NVMe ports; Optional 12 SAS3 ports via AOC; Optional 2 hot-swap 2.5" rear drive bays for SSDs 6. 4x heavy duty fans w/ optimal fan speed control 7. 1000W High efficiency (96%) Redundant PSU; Titanium Level

Up to 4TB ECC DDR4-3200: LRDIMM/RDIMM 2x 25G SFP+ Ports Onboard 12x 3.5" hot-swap SAS/SATA, 4x hot-swap EDSFF Short Bays, 2x 2.5" 7mm NVMe/Hot-Swap SATA drive bays Front LED Indicator for each drive Host Bus Adapter via Broadcom® 3224 PCI-E 4.0 x16 AIOM Support + 3 PCI-E 4.0 LP Slots

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 12 DIMM slots 3. 24 U.2 Hot-swap dual-port NVMe drive bays 4. 2 PCI-E 3.0 x16 HHHL slots, 1 PCI-E 3.0 x16 SIOM 5. Dedicated node to node connectivity featuring high performance PLX NTB PCI-E 3.0 x8 and IPMI for robust node fail-over support 6. Dual port 10GBase-T (Intel® X557-AT2), Dual 10G private ethernet between controller nodes 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 5x 8cm high-performance PWM fans 9. 2000W Redundant Power Supplies Titanium Level (96%)

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8, 1 SIOM card support (flexible networking) Note: must bundle with Network card