Intel 3647

2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots Intel® C622 chipset Expansion slots: 1 PCI-E 3.0 x16 (x16 || x8), 1 PCI-E 3.0 x8 (x0 || x8), 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8) 2 10GbE LAN ports 10 SATA3 (6Gbps) via C622 8 SAS3 (12Gbps) via Broadcom® 3008; RAID 0, 1, 10 2x Port NVMe PCI-E 3.0 x4 via OCuLink 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 8 USB 2.0 (2 rear, 6 via headers) M.2 NGFF connector M.2 Interface: PCI-E 3.0 x4 and SATA Form Factor: 2280 Key: M-Key Double Height Connector

2nd Gen Intel® Xeon® Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots Intel® C622 chipset Expansion slots: 1 PCI-E 3.0 x8 (in x16), 1 PCI-E 3.0 x32 Left Riser slot 4 SAS3 (12Gbps) via Broadcom® 3008; RAID 0, 1, 10 2 10GbE LAN ports 10 SATA3 (6Gbps) via C622 I/O: 1 VGA, 2 COM, TPM header 2 SuperDOM with built-in power M.2 NGFF connectorM.2 Interface: PCI-E 3.0 x4 and SATAForm Factor: 2280, 22110Key: M-Key Double Height Connector

Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s Intel® C627 Up to 2TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots