GIGABYTE XV23-VC0 (rev. AAJ1) - 6NXV23VC0DR000AAJ1
Supports up to 4 x Dual slot Gen5 GPUs High-performance CPU for HPC and cloud computing NVIDIA MGX™ modular server design NVIDIA Grace™ CPU Superchip 900GB/s NVIDIA NVLink™-C2C Interconnect Up to 960GB CPU LPDDR5X ECC memory Compatible with NVIDIA BlueField®-3 DPUs 2 x 2.5" Gen5 NVMe hot-swap bays 2 x M.2 slots with PCIe Gen5 x4 interface 4 x FHFL PCIe Gen5 x16 slots for GPUs 2 x FHFL PCIe Gen5 x16 slots for add-in cards 2+2 2000W 80 PLUS Titanium redundant power supplies
We also offer six months of free collocation in our TIER III data center.
Components are not the end — ask us for a custom server configuration. We will design the server, assemble it, expertly set it up, and provide extended or NBD warranty.
Product code | 202.181440 |
---|---|
Part number | 6NXV23VC0DR000AAJ1 |
Manufacturer | GIGABYTE |
Availability | Not in stock |
Warranty | 36 months |
Weight | 49 kg |
The price includes all legal fees |
Detailed information
Rack servers
Highly flexible, scalable rack servers optimized for demanding applications in data centers. Rack density from 1U to 5U, servers are designed for single and multi-socket varieties of x86 processors from AMD and Intel as well as for ARM processors from Ampere.
Applications Include
Big Data
High Performance Computing (HPC)
Hyper-converged infrastructure (HCI)
Software-defined Storage (SDS)
Virtualization
Only the best with GIGABYTE
Strong R&D and forward ideas to deliver the values that can help you succeed in the future.
High Performance
Servers and motherboards by GIGABYTE are tested to ensure peak performance for demanding CPU workloads. All the latest technology is supported.
Compute Density
One single socket solution can outperform many dual CPU servers. Dual socket models also support up to hundreds of cores in a 1U-5U chassis. More compact performance.
Fast & Stable Connectivity
Keeping pace with the challenges for next gen technology, well designed GIGABYTE boards provide users the signal integrity for newest PCIe generation.
Modularity
Building block designs allow new models to quickly reach the market. Users can now have BMC on a OCP module customized by GIGABYTE.
Collaboration
GIGABYTE and its partners have maintained a healthy relationship that values shared knowledge in order to get the latest technology into data centers.
Optimal Price
A broad portfolio of servers and products allows customers to only select the features they require which results in a lower total cost of ownership (TCO).
AI Server
AI servers power model training and real-time inference, accelerating AI application development and deployment. With robust computing power, high scalability, and optimized efficiency, they empower businesses to deliver fast and effective AI solutions.
Dimensions | |
Form Factor | 2U |
Server Dimensions( WxHxD ) | 438 x 87 x 900 mm |
Packaging Dimensions | 1196 x 744 x 400 |
Motherboard | |
Part Name | MVC3-MG0 |
Superchip | |
NVIDIA Grace™ CPU Superchip | 2 x NVIDIA Grace™ CPUs |
TDP | Up to 500W |
System Memory | |
Memory Type | 480GB of LPDDR5X memory with ECC |
Storage | |
Disk Bays | Front hot-swap: 2 x 2.5" Gen5 NVMe - (NVMe from CPU_0) |
Internal M.2 | 2 x M.2 (2242/2260/2280/22110), PCIe Gen5 x4, from CPU_1 |
Input / Output | |
LAN | Front: 1 x 10/100/1000 Mbps Management LAN |
Video | 1 x Mini-DP |
PCIe Expansion Slots | |
PCIe Cable x 6 | 2 x FHFL x16 (Gen5 x16), from CPU_0, for GPUs 1 x FHFL x16 (Gen5 x16), from CPU_0 2 x FHFL x16 (Gen5 x16), from CPU_1, for GPUs 1 x FHFL x16 (Gen5 x16), from CPU_1 |
Backplane Board | |
Backplane Board | PCIe Gen5 x4 |
Security Modules | |
TPM | 1 x TPM header with SPI interface - Optional TPM2.0 kit: CTM012 |
Power Supply | |
Certification | 80 PLUS Titanium |
Power | 2000W |
QTY | 2+2 |
Parameters
Size in U | 2 |
---|---|
Depth (mm) | 900 |
CPU manufacturer | NVIDIA |
Socket | SoC NVIDIA |
HDD disks | 4 |
2.5" Drive bays | 2 |
3.5" Drive bays | 0 |
NVMe slots | 4 |
Total amount of PCIe | 6 |
OCP/AIOM | 0 |
Power (W) | 2000 |
Efficiency certification | Titanium |