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Servers GIGABYTE Builds Rackmounts Mainstream GIGABYTE E152-ZE0 (rev. A00) - 6NE152ZE0MR-00-AT

GIGABYTE E152-ZE0 (rev. A00) - 6NE152ZE0MR-00-AT

NVIDIA-Certified Systems™ - Data Center Servers NVIDIA-Certified Systems™ - High-Density VDI Servers NVIDIA-Certified Systems™ - Edge Systems Supports 1 x Dual slot or 2 x Single slot Gen4 GPUs Single AMD EPYC™ 7003/7002 Series Processors 8-Channel DDR4 RDIMM/LRDIMM, 8 x DIMMs 2 x 1Gb/s LAN ports via Intel® I350-AM2 2 x 2.5" Gen4 NVMe/SATA hot-swap bays 2 x M.2 slots with PCIe Gen4 x4 interface 2 x FHFL PCIe Gen4 x16 slots for GPUs 2 x LP PCIe Gen4 x16 slots 1 x OCP NIC 3.0 PCIe Gen4 x16 slot Single 800W 80 PLUS Titanium power supply (-AT0)

We also offer six months of free collocation in our TIER III data center.

Components are not the end — ask us for a custom server configuration. We will design the server, assemble it, expertly set it up, and provide extended or NBD warranty.

Product code 202.181057
Part number 6NE152ZE0MR-00-AT
Manufacturer GIGABYTE
Availability Not in stock
Warranty 36 months
Weight 11 kg
The price includes all legal fees
6 045 PLN ex VAT
6 045 PLN w/ VAT
pc

Detailed information

Rack servers

Highly flexible, scalable rack servers optimized for demanding applications in data centers. Rack density from 1U to 5U, servers are designed for single and multi-socket varieties of x86 processors from AMD and Intel as well as for ARM processors from Ampere.

Applications Include

Big Data

High Performance Computing (HPC)

Hyper-converged infrastructure (HCI)

Software-defined Storage (SDS)

Virtualization

Only the best with GIGABYTE

Strong R&D and forward ideas to deliver the values that can help you succeed in the future.

High Performance

Servers and motherboards by GIGABYTE are tested to ensure peak performance for demanding CPU workloads. All the latest technology is supported.

Compute Density

One single socket solution can outperform many dual CPU servers. Dual socket models also support up to hundreds of cores in a 1U-5U chassis. More compact performance.

Fast & Stable Connectivity

Keeping pace with the challenges for next gen technology, well designed GIGABYTE boards provide users the signal integrity for newest PCIe generation.

Modularity

Building block designs allow new models to quickly reach the market. Users can now have BMC on a OCP module customized by GIGABYTE.

Collaboration

GIGABYTE and its partners have maintained a healthy relationship that values shared knowledge in order to get the latest technology into data centers.

Optimal Price

A broad portfolio of servers and products allows customers to only select the features they require which results in a lower total cost of ownership (TCO).

Edge Server

Real-time data processing at the source reduces latency for real-time analytics, IoT, and 5G networks. These servers are deployed in compact locations and are designed to continue running even when internet connection is lost.

Dimensions
Form Factor 2U
Server Dimensions( WxHxD ) 438 x 43.5 x 400 mm
Packaging Dimensions 1082 x 685 x 314 mm
Motherboard
Part Name MZE2-G10
Processor
CPU AMD EPYC™ 7003 Series Processors
AMD EPYC™ 7002 Series Processors
Socket SP3
QTY 1
Chipset System on Chip
System Memory
Memory Type RDIMM
DDR4
Memory Frequency RDIMM/LRDIMM: Up to 3200/2933 MT/s
Memory Slots 8
Storage
Disk Bays Front hot-swap:
2 x 2.5" Gen4 NVMe/SATA

Internal M.2 (CMTP182):
2 x M.2 (2280/22110), PCIe Gen4 x4
PCI Express
Slots 1 x FHFL x16 (Gen4 x16), for GPUs
1 x FHFL x16 (Gen4 x16), for GPUs
2 x LP x16 (Gen4 x16)
OCP 1 x OCP NIC 3.0 (Gen4 x16)
- Supports NCSI function
Input / Output
LAN Front:
2 x 1Gb/s LAN (1 x Intel® I350-AM2)
- Support NCSI function

1 x 10/100/1000 Mbps Management LAN
Video 1 x Mini-DP
Backplane Board
Backplane Board PCIe Gen4 x4 or SATA 6Gb/s
Security Modules
TPM 1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010
Power Supply
Certification 80 PLUS Titanium
Power 800W
QTY 1
Environment Properties
Operating Temperature:
10°C to 35°C

Humidity:
8% to 80%
(non-condensing)
Non-operating Temperature:
-40°C to 60°C

Humidity:
20% to 95%
(non-condensing)

Parameters

Size in U 1
Depth (mm) 400
CPU manufacturer AMD
Socket SP3
HDD disks 4
2.5" Drive bays 2
3.5" Drive bays 0
NVMe slots 4
Total amount of PCIe 4
OCP/AIOM 1
Power (W) 800
Efficiency certification Titanium

Price development



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