Components

Cloud Backup, Data Replication, or High Density Archive Storage Applications 2U Storage JBOD Chassis with capacity 12 x 3.5" hot-swappable HDDs bays Single Expander Backplane Boards support SAS3/2 or SATA3 HDDs with 12Gb/s throughput 4 x Mini-SAS HD ports for Internal / External Cascading Expander Combination for high performance, high availability or high redundancy requirements 1x IPMI port for Remote System Power on/off and system monitoring Support NTP for time synchronization & RTC battery backup 740W (1+1) 95% efficient Platinum level power supplies 3 x 80mm high efficient hot-swappable fans for best system cooling Ideal for Cloud backup, data Replication or High desnsity Archive Storage Applications Qualified SAS HBA / controller: AOC-SAS3-9300-8E - 12Gb/s 2-external ports SAS3 HBA AOC-SAS3-9380-8E - 12Gb/s 2-external ports SAS3 RAID Controller

Capacity: 1024 GB BUS: M2 M/B-key SATA Format: M2 2280 Speed: 560 MBps (read) / 340 MBps (write) Lifetime: Unknown DWPD Technology: 3D TLC NAND

AMD® Ryzen™ Embedded V1605B Quad Cores Processor Integrated Graphics Processor – Radeon™ Vega 8 Graphics Dual Channel DDR4 2400, 2 x SO-DIMMs, Max 32GB 4 x HDMI ports, supporting a maximum resolution of 4096x2160@60Hz 2 x GbE LAN ports, Wi-Fi 802.11ac / BT4.2 ALC 269 Audio Codec 2 x M.2 for SSD (1 x PCIe/SATA Mode, 1 x SATA Mode)

1. Black anodized brushed aluminum fascia front panel with two USB 3.0 ports 2. Removable 3.5” and 2.5” HDD/SSD cages with tool-less trays for up to 10 drives 3. Tool-less 5.25” device installation with trays to support 3.5” and 2.5” drives 4. Cable management holes with rubber grommets for clean builds 5. Removable magnetic dust filter 6. One click front grille access 7. Large motherboard tray cut-out for CPU cooler back-plates8. 3x 120mm PWM fans included

Single AMD EPYC™ 7001/7002* Series Processor (*AMD EPYC 7002 series drop-in support requires board revision 2.x) 2.1TB Registered ECC DDR4 2666MHz SDRAM in 8 DIMMs 2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs (Board revision 2.x required) Expansion slots:  3 PCI-E 3.0 x16  3 PCI-E 3.0 x8  M.2 Interface: 1 PCI-E 3.0 x4  M.2 Form Factor: 2280, 22110  M.2 Key: M-key 8 SATA 3.0 + Broadcom 3008 for 8 SAS3 ports + 2 NVMe, 1 M.2

Output: 300 W Format: 4U/ATX Certification: bronze Efectivity: 82

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Intel® C612 chipset 3. Up to 1TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 8x DIMM slots 4. 2x PCI-E 3.0 x16, 1x PCI-E 3.0 x8 (in x16), 1x PCI-E 3.0 x4 (in x8)

Capacity: 128GB BUS: SATAIII Format: M.2 Speed: 550 MBps (read) / 520 MBps (write) Technology: 3D TLC

Mini-SAS to Mini-SAS HD 500mm w/o SB for expender only. 30AWG