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C622

The new generation of Supermicro X11 motherboards offers the highest levels of performance, efficiency, security, reliability and scalability with up to 6TB DDR4 2933MHz memory in 24 DIMM slots supporting Intel Optane ™ DC Persistent Memory, 7 PCI-E slots and 10GBase-T / 10G SFP + / 56Gbps FDR InfiniBand Networking Options.

Manufacturer

  1. ASUS
    ASUS
  2. Supermicro
    Supermicro
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Products in category

Supermicro MBD-X11DPH-T-B

2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 3 UPI up to 10.4 GT/s Intel® C622
254 684,00 HUF ex VAT
254 684,00 HUF w/ VAT
In stock
Stock allocation and delivery options
Transport company across Europe
Wednesday 16. 7. at the latest Tuesday 22. 7.

Supermicro MBD-X11SPM-TF-O

Intel® Xeon® Scalable Processors, Single Socket P (LGA 3647) supported, CPU TDP support 165W Intel® C622 chipset Up to 768GB ECC 3DS LRDIMM, up to DDR4-2666MHz; 6x DIMM slots
194 965,00 HUF ex VAT
194 965,00 HUF w/ VAT
In stock
Stock allocation and delivery options
Transport company across Europe
Wednesday 16. 7. at the latest Tuesday 22. 7.

Supermicro MBD-X11SPi-TF-B

Intel® Xeon® Scalable Processors, Single Socket P (LGA 3647) supported, CPU TDP support 205W Intel® C622 chipset Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8x DIMM slots
259 991,00 HUF ex VAT
259 991,00 HUF w/ VAT
In stock
Stock allocation and delivery options
Transport company across Europe
Wednesday 16. 7. at the latest Tuesday 22. 7.

Supermicro MBD-X11SPM-TF-B

2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 165W TDP Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots; Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only) Intel® C622 chipset Expansion slots: 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 (in x8) 2 10GbE LAN ports 12 SATA3 (6Gbps) via C622
193 746,00 HUF ex VAT
193 746,00 HUF w/ VAT
In stock
Stock allocation and delivery options
Transport company across Europe
Wednesday 16. 7. at the latest Tuesday 22. 7.

Supermicro MBD-X11SPW-TF-B

Intel® Xeon® Scalable Processors, Single Socket P (LGA 3647) supported, CPU TDP support 205W Intel® C622 chipset Up to 768GB ECC 3DS LRDIMM, up to DDR4-2666MHz; 6x DIMM slots
185 685,00 HUF ex VAT
185 685,00 HUF w/ VAT
Not in stock
Stock allocation and delivery options
Transport company across Europe
Wednesday 13. 8. at the latest Wednesday 13. 8.

Supermicro MBD-X11SPW-TF-O

2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Single Socket P (LGA 3647) supported, CPU TDP support 205W Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots Intel® C622 chipset
186 510,00 HUF ex VAT
186 510,00 HUF w/ VAT
Not in stock
Stock allocation and delivery options
Transport company across Europe
Wednesday 13. 8. at the latest Wednesday 13. 8.

Supermicro MBD-X11DDW-NT-B

2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors Intel® C622 Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only). 1 PCI-E 3.0 x32 Left Riser Slot,1 PCI-E 3.0 x16 1 VGA port Intel® C622 controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10 Dual LAN with 10Gbase-Tfrom C622
251 498,00 HUF ex VAT
251 498,00 HUF w/ VAT
Not in stock
Stock allocation and delivery options
Transport company across Europe
Wednesday 13. 8. at the latest Wednesday 13. 8.

Supermicro MBD-X11DPI-NT-B

2nd Gen Intel® Xeon® Scalable Intel® C622 Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz Or 2TB DCPMM, DDR4-2666MHz 4 PCI-E 3.0 x16,2 PCI-E 3.0 x8M.2 Interface: PCI-E 3.0 x4M.2 Form Factor: 2260, 2280, 22110M.2 Key: M-Key,2 PCI-E 3.0 NVMe x4 Internal Port(s) 1 VGA port Intel® C622 controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10 Dual LAN with 10GBase-T with Intel® X722 + X557
249 073,00 HUF ex VAT
249 073,00 HUF w/ VAT
Not in stock
Stock allocation and delivery options
Transport company across Europe
Wednesday 13. 8. at the latest Wednesday 13. 8.

Supermicro MBD-X11SPH-NCTF-B

2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots Intel® C622 chipset Expansion slots: 1 PCI-E 3.0 x16 (x16 || x8), 1 PCI-E 3.0 x8 (x0 || x8), 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8) 2 10GbE LAN ports 10 SATA3 (6Gbps) via C622 8 SAS3 (12Gbps) via Broadcom® 3008; RAID 0, 1, 10 2x Port NVMe PCI-E 3.0 x4 via OCuLink 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 8 USB 2.0 (2 rear, 6 via headers) M.2 NGFF connector M.2 Interface: PCI-E 3.0 x4 and SATA Form Factor: 2280 Key: M-Key Double Height Connector
249 732,00 HUF ex VAT
249 732,00 HUF w/ VAT
Not in stock
Stock allocation and delivery options
Transport company across Europe
Wednesday 13. 8. at the latest Wednesday 13. 8.

Supermicro MBD-X11DDW-NT-O

Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s, Intel® C622 Up to 1.5TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2666MHz,
251 510,00 HUF ex VAT
251 510,00 HUF w/ VAT
Not in stock
Stock allocation and delivery options
Transport company across Europe
Wednesday 13. 8. at the latest Wednesday 13. 8.

Supermicro X11DPI-NT-O

Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s, CPU1: Skylake-F CPU supported Intel® C622 Up to 2TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
253 135,00 HUF ex VAT
253 135,00 HUF w/ VAT
Not in stock
Stock allocation and delivery options
Transport company across Europe
Wednesday 13. 8. at the latest Wednesday 13. 8.

Supermicro MBD-X11SPW-CTF-O

2nd Gen Intel® Xeon® Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots Intel® C622 chipset Expansion slots: 1 PCI-E 3.0 x8 (in x16), 1 PCI-E 3.0 x32 Left Riser slot 4 SAS3 (12Gbps) via Broadcom® 3008; RAID 0, 1, 10 2 10GbE LAN ports 10 SATA3 (6Gbps) via C622 I/O: 1 VGA, 2 COM, TPM header 2 SuperDOM with built-in power M.2 NGFF connectorM.2 Interface: PCI-E 3.0 x4 and SATAForm Factor: 2280, 22110Key: M-Key Double Height Connector
214 948,00 HUF ex VAT
214 948,00 HUF w/ VAT
Not in stock
Stock allocation and delivery options
Transport company across Europe
Wednesday 13. 8. at the latest Wednesday 13. 8.




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