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C622

The new generation of Supermicro X11 motherboards offers the highest levels of performance, efficiency, security, reliability and scalability with up to 6TB DDR4 2933MHz memory in 24 DIMM slots supporting Intel Optane ™ DC Persistent Memory, 7 PCI-E slots and 10GBase-T / 10G SFP + / 56Gbps FDR InfiniBand Networking Options.

Manufacturer

  1. ASUS
    ASUS
  2. Supermicro
    Supermicro
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Products in category

Supermicro MBD-X11DPH-T-B

2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 3 UPI up to 10.4 GT/s Intel® C622
15 752 Kč ex VAT
15 752,00 Kč w/ VAT
In stock
Stock allocation and delivery options
Transport company across Europe
Wednesday 16. 7. at the latest Tuesday 22. 7.

Supermicro MBD-X11SPM-TF-B

2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 165W TDP Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots; Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only) Intel® C622 chipset Expansion slots: 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 (in x8) 2 10GbE LAN ports 12 SATA3 (6Gbps) via C622
11 983 Kč ex VAT
11 983,00 Kč w/ VAT
In stock
Stock allocation and delivery options
Transport company across Europe
Wednesday 16. 7. at the latest Tuesday 22. 7.

Supermicro MBD-X11SPi-TF-B

Intel® Xeon® Scalable Processors, Single Socket P (LGA 3647) supported, CPU TDP support 205W Intel® C622 chipset Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8x DIMM slots
16 080 Kč ex VAT
16 080,00 Kč w/ VAT
In stock
Stock allocation and delivery options
Transport company across Europe
Wednesday 16. 7. at the latest Tuesday 22. 7.

Supermicro MBD-X11SPM-TF-O

Intel® Xeon® Scalable Processors, Single Socket P (LGA 3647) supported, CPU TDP support 165W Intel® C622 chipset Up to 768GB ECC 3DS LRDIMM, up to DDR4-2666MHz; 6x DIMM slots
12 059 Kč ex VAT
12 059,00 Kč w/ VAT
In stock
Stock allocation and delivery options
Transport company across Europe
Wednesday 16. 7. at the latest Tuesday 22. 7.

Supermicro MBD-X11SPW-TF-O

2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Single Socket P (LGA 3647) supported, CPU TDP support 205W Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots Intel® C622 chipset
11 536 Kč ex VAT
11 536,00 Kč w/ VAT
Not in stock
Stock allocation and delivery options
Transport company across Europe
Wednesday 13. 8. at the latest Wednesday 13. 8.

Supermicro MBD-X11SPM-TPF-B

Intel® Xeon® Scalable Processors, Single Socket P (LGA 3647) supported, CPU TDP support 165W Intel® C622 chipset Up to 768GB ECC 3DS LRDIMM, up to DDR4-2666MHz; 6x DIMM slots
11 083 Kč ex VAT
11 083,00 Kč w/ VAT
Not in stock
Stock allocation and delivery options
Transport company across Europe
Wednesday 13. 8. at the latest Wednesday 13. 8.

Supermicro MBD-X11SPH-NCTF-B

2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots Intel® C622 chipset Expansion slots: 1 PCI-E 3.0 x16 (x16 || x8), 1 PCI-E 3.0 x8 (x0 || x8), 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8) 2 10GbE LAN ports 10 SATA3 (6Gbps) via C622 8 SAS3 (12Gbps) via Broadcom® 3008; RAID 0, 1, 10 2x Port NVMe PCI-E 3.0 x4 via OCuLink 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 8 USB 2.0 (2 rear, 6 via headers) M.2 NGFF connector M.2 Interface: PCI-E 3.0 x4 and SATA Form Factor: 2280 Key: M-Key Double Height Connector
15 446 Kč ex VAT
15 446,00 Kč w/ VAT
Not in stock
Stock allocation and delivery options
Transport company across Europe
Wednesday 13. 8. at the latest Wednesday 13. 8.

Supermicro MBD-X11SPM-TPF-O

Intel® Xeon® Scalable Processors, Single Socket P (LGA 3647) supported, CPU TDP support 165W Intel® C622 chipset Up to 768GB ECC 3DS LRDIMM, up to DDR4-2666MHz; 6x DIMM slots
11 159 Kč ex VAT
11 159,00 Kč w/ VAT
Not in stock
Stock allocation and delivery options
Transport company across Europe
Wednesday 13. 8. at the latest Wednesday 13. 8.

Supermicro MBD-X11SPW-TF-B

Intel® Xeon® Scalable Processors, Single Socket P (LGA 3647) supported, CPU TDP support 205W Intel® C622 chipset Up to 768GB ECC 3DS LRDIMM, up to DDR4-2666MHz; 6x DIMM slots
11 485 Kč ex VAT
11 485,00 Kč w/ VAT
Not in stock
Stock allocation and delivery options
Transport company across Europe
Wednesday 13. 8. at the latest Wednesday 13. 8.

Supermicro MBD-X11SPW-CTF-O

2nd Gen Intel® Xeon® Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots Intel® C622 chipset Expansion slots: 1 PCI-E 3.0 x8 (in x16), 1 PCI-E 3.0 x32 Left Riser slot 4 SAS3 (12Gbps) via Broadcom® 3008; RAID 0, 1, 10 2 10GbE LAN ports 10 SATA3 (6Gbps) via C622 I/O: 1 VGA, 2 COM, TPM header 2 SuperDOM with built-in power M.2 NGFF connectorM.2 Interface: PCI-E 3.0 x4 and SATAForm Factor: 2280, 22110Key: M-Key Double Height Connector
13 295 Kč ex VAT
13 295,00 Kč w/ VAT
Not in stock
Stock allocation and delivery options
Transport company across Europe
Wednesday 13. 8. at the latest Wednesday 13. 8.

Supermicro MBD-X11SPW-CTF-B

2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots Intel® C622 chipset Expansion slots: 1 PCI-E 3.0 x8 (in x16), 1 PCI-E 3.0 x32 Left Riser slot 4 SAS3 (12Gbps) via Broadcom® 3008; RAID 0, 1, 10 2 10GbE LAN ports 10 SATA3 (6Gbps) via C622 I/O: 1 VGA, 2 COM, TPM header 2 SuperDOM with built-in power M.2 NGFF connectorM.2 Interface: PCI-E 3.0 x4 and SATAForm Factor: 2280, 22110Key: M-Key Double Height Connector
13 134 Kč ex VAT
13 134,00 Kč w/ VAT
Not in stock
Stock allocation and delivery options
Transport company across Europe
Wednesday 13. 8. at the latest Wednesday 13. 8.

Supermicro X11DPI-NT-O

Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s, CPU1: Skylake-F CPU supported Intel® C622 Up to 2TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
15 656 Kč ex VAT
15 656,00 Kč w/ VAT
Not in stock
Stock allocation and delivery options
Transport company across Europe
Wednesday 13. 8. at the latest Wednesday 13. 8.




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