4 GPU

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 12 DIMM slots 3. 4 PCI-E 3.0 x16 slots 4. 2 Hot-swap 2.5" SAS/SATA drive bays, 2 Internal 2.5" drive bays

Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors Intel® C621A Chipset 32 DIMM Slots; Up to 8TB DRAM; 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM 4U system with NVIDIA® HGX™ A100 4-GPU 6 PCI-E Gen 4.0 X16 LP Slots Highest GPU communication using NVIDIA® NVLINK™ Supports HGX A100 4-GPU 40GB (HBM2) or 80GB (HBM2e)

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 1TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16 DIMM slots 3. 3 PCI-E 3.0 x16 slots, 1 PCI-E 3.0 x8 Low-profile slot 4. 2 10GBase-T LAN via Intel X540

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 4 PCI-E 3.0 x16 (FHFL) slots, 1 PCI-E 3.0 x8 (in x16, LP) slots

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 12 DIMM slots 3. 4 PCI-E 3.0 x16 (FHFL) slots, 2 PCI-E 3.0 x16 (LP) slots 4. 2 Hot-swap 2.5" SAS/SATA drive bays, 2 Internal 2.5" drive bays 5. 2x 10GBase-T LAN ports via Intel X540 6. 9 Heavy duty 4cm counter-rotating fans with air shroud & optimal fan speed control 7. 2000W Redundant Power Supplies Titanium Level (96%)

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 1TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16 DIMM slots 3. 3 PCI-E 3.0 x16 slots, 1 PCI-E 3.0 x8 Low-profile slot 4. Intel i350 Dual port GbE LAN 5. 2 Hot-swap 2.5" drive bays, 2 internal 2.5" drive bays 6. 7x 4cm heavy duty counter-rotating fans with air shroud & optimal fan speed control 7. 2000W Redundant Power Supplies Titanium Level (96%)