Supermicro

Single AMD EPYC™ 7001/7002* Series Processor 1TB Registered ECC DDR4 2666MHz SDRAM in 8 DIMMs 2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs 8 SATA 3.0 + Broadcom 3008 for 8 SAS3 ports, 1 M.2 Dual Gigabit Ethernet LAN Ports ASPEED AST2500 BMC graphics Up to 5 USB 3.0 ports 7 PWM 4-pin Fans with tachometer status monitoring

7th Generation Intel® Core™ i5-7300U Processor Up to 32GB Unbuffered Non-ECC SO-DIMM DDR4 2133MHz; 2 DIMM slots Dual GbE LAN w/ Intel i219LM + i210IT 1 M.2 B-Key 2280, 1 Full size Mini-PCI-E, 1 SATA 3.0

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Intel® C612 chipset 3. Up to 1TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 8x DIMM slots 4. 1x PCI-E 3.0 x16, 2x PCI-E 3.0 x8

Optimized for WIO (W series) motherboards, support MB size up to 12.3" x 13.4" 4 x 3.5"(tool-less) or 2.5"(screw) hot-swap SAS3/SATA drive bay SAS or enterprise SATA HDD only recommended 1U SAS/SATA Backplane with SES2 support 1U 500W Redundant power supply Platinum level, 24Pin output 2x full-height & full-length expansion slot(s) 1x low-profile expansion slot 3 x 40x56mm counter-rotation PWM fan(s) Support Service Tag for system information OEM Only, MOQ Applies

Dual Port QSFP28 Connector Low-Profile, Short Length Standard Form Factor PCI-E 4.0 x16 backward compatible to PCI-E 3.0 x16 Broadcom BCM57508 Ethernet Controller Asset Management Feature with thermal sensor IEEE 1588 PTP and IEEE 802.1AS Energy Efficient Ethernet IEEE Std 802.2az Truflow NPAR Low Latency RDMA over Converged Ethernet (RocE v1 and v2) VxLAN, NVGRE and Geneve NetQueue, VMQueue and MultipleQueue Jumbo Frames up to 9600-Bye NC-SI for IPMI support

Intel® 8th Generation Core™ i5-8365UE Processor Dual Channel DDR4 2400MHz SO-DIMM, up to 64GB Intel UHD Graphics 620 with 4K and 24 EU for Vision Solution 3 display support(DP++, HDMI and 48-bit LVDS) Small form factor with rich I/O: 2 GbE, 8 USB and 6 COM Rich expansion: 3 x M.2 (B/E/M key) for NVMe/SATA/Wifi/BT/LTE 12-24V wide range power input with RVP and TVS Without heatsink for customer's flexible thermal design

Output: 2200 W Format: 2U Certification: platinum

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Intel® C612 chipset 3. Up to 1TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 8x DIMM slots 4. Expansion slot: 1x PCI-E 3.0 x8 5. Intel® X540 Dual port 10GBase-T

Support STD and WIO MB Up to 2 x 2.5" fixed with bracket 1U 400W Redundant Power Supply Platinum with PMBUS, W54.5xL220xH40mm Up to , 2 full height expansion slot(s) 4 x 40x56mm PWM fan(s) Optional 2 x fans for AOC cooling

Intel® Xeon® processor D-1518, Single socket FCBGA 1667; 4-Core, 8 Threads, 35W Up to 128GB ECC RDIMM DDR4 2133MHz or 64GB ECC/non-ECC UDIMM in 4 sockets 2 PCI-E 3.0 x8, Mini PCI-E (mSATA support), M.2 PCI-E 3.0 x4 (SATA support), M Key 2242/2280/22110 2 10G SFP+ and 6 GbE LAN 4 SATA3 (6Gbps) ports via SoC 2 USB 3.0 ports (rear), 5 USB 2.0 ports (4 via headers, 1 Type A) 2 SuperDOM, 1 COM, TPM 2.0 header, GPIO and SMbus headers 12V DC Input and ATX Power Sourc

1. 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 3 UPI up to 10.4 GT/s 2. Intel® C621 3. Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz Or 2TB DCPMM, DDR4-2666MHz, in 16 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only); 4. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 M.2 Interface: 2 PCI-E 3.0 x4 M.2 Form Factor: 2242/2260/2280/22110 M.2 Key: M-Key (RAID 0,1 support) 5. Intel® C621 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10 6. Dual LAN with 1GbE with Intel® X722 + Marvell 88E1512 7. 1 VGA port

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Intel® C612 chipset 3. Up to 1TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 8 DIMM slots 4. Expansion slots: 4x PCI-E 3.0 x8 5. Intel® 82599ES Dual port 10G SFP+