Supermicro SYS-E100-9W-C

1. Single socket H4 (LGA 1151) supports Intel® Xeon® processor E-2100 / E-2200 series, 8th Gen. Intel® Core™ i3 Processors, Intel® Celeron®, Intel® Pentium® 2. Intel® C242 chipset 3. Up to 64GB ECC UDIMM, up to DDR4-2666MHz; 2 DIMM slots 4. 1 PCI-E 3.0 x16 slot (for LP AOC)

1. Single socket H4 (LGA 1151) supports Intel® 7th/6th Gen. Core™ i7/i5/i3 series 2. Intel® Z270 Express Chipset 3. Up to 64GB Non-ECC UDIMM, DDR4-3733MHz (OC), in 4 DIMM slots 4. 4 PCI-E 3.0 x16 (run at 16/NA/16/NA, 8/8/8/8, Auto Switch), 1 PCI-E 3.0 x4 5. 2 PCIe 3.0 x4 M.2 (support 22110) 1 compatible w/ SATA; RAID 0, 1 support 6. 2 PCIe 3.0 x4 U.2 (1 share with M.2); RAID 0, 1 support 7. USB 3.1/3.0/2.0, 2 GbE LAN ports (1 via Intel i210-AT, 1 via Intel i219V) 8. Removable 3.5" and 2.5" HDD/SSD cages with tool-less trays for up to 10 drives; 2x 5.25" Peripheral Drive Bays 9. 1 DP (Display Port), 1 HDMI 10. HD Audio 7.1 channel connector by Realtek ALC1150, support SPDIF-Out 11. 750W Multi-output ATX Power Supply with modular cable; 80Plus Gold

1. Single Socket H4 (LGA 1151) supports Intel® Xeon® processor E-2100 / E-2200 series, 8th/9th Gen. Intel® Core™ i9/i7/i5/i3 Processors, Intel® Celeron®, Intel® Pentium® 2. Intel® C246 chipset 3. Up to 128GB* ECC/non-ECC UDIMM, up to DDR4-2666MHz; 4 DIMM slots 4. 2 PCI-E 3.0 x16 running at NA/16 or 8/8, 1 PCI-E 3.0 x4 slot, 1 PCI-E 3.0 x1 slot 5. 2 M.2 (M-key, 2260/2280/22110), 1 U.2 for optional expanded storages 6. 2 USB Type A & Type C, 4 USB 3.1 Gen1 (2 rear + 2 front), 2 USB 2.0 (front) 7. 1 HDMI 2.0a port, 1 DVI-Dport, 1 DP 1.2 port, 1 TPM header, 1 COM header 8. 4 Fixed 3.5", Opt. 4 2.5" drive bays, 2 Standard 5.25" drive bays, 1 Fixed 3.5" device bay 9. 500W Bronze Certified High Efficient Power Supply

1. Single Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 12 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM 3. 4 PCI-E 3.0 x16, 3 PCI-E 3.0 x8 (in x16) slots, M.2 Interface: 4 PCI-E 3.0 x4 M.2 Form Factor: 2242/2260/2280/22110 M.2 Key: M-Key * M.2 support RAID 0,1 (up to RAID 5, 10), VROC key is required for RAID 1 4. 1x 10GBase-T and 1x 1GbE LAN ports 5. 7.1 HD Audio 6. 8 Hot-swap 3.5" SAS3/SATA3 drive bays with SGPIO 7. 1000/1200W Multi-output Power Supply Platinum Level Certified

1. Single Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ Intel® Xeon® W-32xx processor 2. Intel® Xeon® Scalable Processors: Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz; or 3TB DCPMM, DDR4-2666MHz, in 12 DIMM slots. Intel® Xeon® W-3200 Processors: Up to 2TB 3DS ECC L/RDIMM; up to 1TB 3DS L/RDIMM. (Xeon® W-3200 doesn't support DCPMM.) 3. 4 PCI-E 3.0 x16, 3 PCI-E 3.0 x8 (in x16 slot) M.2 Interface: 4 PCI-E 3.0 x4, RAID 0, 1 M.2 Form Factor: 2242/2260/2280/22110 M.2 Key: M-Key 4. 1x 10GBase-T and 1x 1GbE LAN ports 5. 8 Hot-swap 3.5" SAS/SATA bay with SGPIO 6. 1 VGA port, VGA connector is dedicated for IPMI 7. 7.1 HD Audio 8. 2200W Redundant Power Supplies Titanium Level Certified

1. Single Socket H4 (LGA 1151) supports Intel® Xeon® processor E-2100 / E-2200 series, 9th/8th Gen. Intel® Core™ i3 Processors, Intel® Celeron®, Intel® Pentium® 2. Intel® C242 chipset 3. Up to 128GB ECC UDIMM, up to DDR4-2666MHz; 4 DIMM slots 4. 1 PCI-E 3.0 x8 (in x16) slot, 2 PCI-E 3.0 x4 (in x8) slots 5. 4 internal 3.5" drive bays, 2 external 5.25" peripheral bays 6. M.2 Interface: 1 PCI-E 3.0 x4 M.2 Form Factor: 22110/2280 M.2 Key: M-Key 7. 2 USB 3.1 Gen1 (front), 2 USB 3.1 Gen1 (rear), 2 USB 2.0 (rear) 8. 1 COM port, 1 VGA port Power Supply 9. 400W Gold Certified High Efficient Power Supply

8th Generation Intel® Core™ i7-8665UE Processor; Single Socket FCBGA-1528, System-on-Chip, M.2: M-Key 2242/2280, E-Key, 2230, B-Key 2242/2280, Up to 64GB Unbuffered Non-ECC, SO-DIMM DDR4 2400MHz; 2 DIMM slots, Dual GbE LAN w/ Intel i219LM + i210IT, 4 COM (RS-232/422/485), 4 USB 3.1, 1 DIO via DB9 7. 1 HDMI and 1 Display Port 8. Fanless design 9. Lockable 12V DC 60W power adapter