Servers Supermicro builds TwinSolutions BigTwin Supermicro SYS-2029BZ-HNR

Supermicro SYS-2029BZ-HNR

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS L/RDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16 (LP) slot; 1 SIOM card support (flexible networking)

We also offer six months of free collocation in our TIER III data center.

Components are not the end — ask us for a custom server configuration. We will design the server, assemble it, expertly set it up, and provide extended or NBD warranty.

The price includes all legal fees
Product code	202.152758
Part number	SYS-2029BZ-HNR
EAN	672042328796
Manufacturer	Supermicro
Availability	Not in stock
Warranty	24 months
Weight	32 kg

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Parameters

Detailed information

Integrated Board

Super X11DPT-BH

Coming Soon

Key Features
- Compute Intensive Application
- HPC, Data Center, Enterprise
Server
- Hyperscale / Hyperconverged

Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

1. Dual socket P (LGA 3647) supports
Intel® Xeon® Scalable Processors,
3 UPI up to 10.4GT/s

2. Up to 3TB ECC 3DS L/RDIMM, up to
DDR4-2666MHz; 24 DIMM slots

3. 2 PCI-E 3.0 x16 (LP) slot; 1 SIOM
card support (flexible networking)
Note: must bundle with Network card

4. IPMI 2.0 + KVM with dedicated LAN

5. 6 Hot-swap 2.5" NVMe drive bays;
2 M.2 SATA3 or NVMe support

6. Video via Aspeed AST2500 BMC

7. 16 Heavy duty 40x56mm fans
with optimal fan speed control
(4 fans per node)

8. 2600W Redundant Power Supplies
Titanium Level (96%)


Product SKUs

SYS-2029BZ-HNR	SuperServer 2029BZ-HNR (Black)


Motherboard

Super X11DPT-BH


Processor/Cache

CPU	Dual Socket P (LGA 3647) Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s Support CPU TDP 70-205W*
Cores	Up to 28 Cores with Intel® HT Technology
Note	* 200W/205W CPUs are supported under certain configurations.


System Memory

Memory Capacity	24 DIMM slots Up to 3TB ECC 3DS LRDIMM, 3TB ECC RDIMM, DDR4 up to 2666MHz
Memory Type	2666/2400/2133MHz ECC DDR4 SDRAM


On-Board Devices

Chipset	Intel® C621 chipset
Network	Must bundle with at least one SIOMnetwork card
IPMI	Support for Intelligent Platform Management Interface v.2.0 IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Video	ASPEED AST2500 BMC


Input / Output (per Node)

LAN	1 RJ45 Dedicated IPMI LAN port
USB	2 USB 3.0 ports (rear)
Video	1 VGA port
DOM	1 SuperDOM (Disk on Module) port


System BIOS

BIOS Type	AMI 32Mb SPI Flash ROM


Management

Software	Intel® Node Manager IPMI 2.0 KVM with dedicated LAN SSM, SPM, SUM SuperDoctor® 5 Watch Dog
Power Configurations	ACPI / APM Power Management


PC Health Monitoring

CPU	Monitors for CPU Cores, Chipset Voltages, Memory. 4+1 Phase-switching voltage regulator
FAN	Fans with tachometer monitoring Status monitor for speed control Pulse Width Modulated (PWM) fan connectors
Temperature	Monitoring for CPU and chassis environment Thermal Control for fan connectors


Chassis

Form Factor	2U Rackmount
Model	CSE-217BHQ+-R2K60FP


Dimensions and Weight

Width	17.6" (447mm)
Height	3.47" (88mm)
Depth	28.75" (730mm)
Package	24.65" (H) x 9.76" (W) x 45.28" (D)
Weight	Gross Weight: 85 lbs (38.6kg) Net Weight: 54.5 lbs (24.7 kg)
Available Colors	Black


Front Panel

Buttons	Power On/Off button UID button
LEDs	Power status LED HDD activity LED Network activity LEDs Universal Information (UID) LED


Expansion Slots (per Node)

PCI-Express	2 PCI-E 3.0 (x16) Low-profile slots 1 SIOM card support (must bundle with network card)


Drive Bays / Storage (per Node)

Hot-swap	6 Hot-swap 2.5" NVMe drive bays
M.2	2 M.2 NVMe or SATA (2240/2260/2280) via optional AOC-SMG3-2H8M2-B


System Cooling

Fans	16 Heavy duty 40x56mm PWM fans with air shroud (4 fans per node)


Power Supply
2600W Redundant Power Supplies with PMBus
Total Output Power	2600W
Dimension (W x H x L)	45 x 40 x 480 mm
Input	208-240Vac/15-12.5A 220-240Vdc/13.5-12.5A (For CQC only)
+12V	Max: 216.6A / Min: 0A
12Vsb	Max: 4.5A / Min: 0A
Output Type	Connector
Certification	UL/cUL/CB/BSMI/CE/CQC Titanium Level [ Cert. in progress ]


Operating Environment

RoHS	RoHS Compliant
Environmental Spec.	Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing)


Parts List - (Items Included)

	Part Number	Qty	Description
Motherboard / Chassis	MBD-X11DPT-BH CSE-217BHQ+-R2K60FP	4 1	Super X11DPT-BH Motherboard 2U Chassis
Backplane	BPN-ADP-6NVME3-1UB	4	6x NVMe ports and 50A power sourcing daughter card for Big Twin
Backplane	BPN-NVME3-217BHQ	1	2U 24-Port 4-Node NVMe Backplane Support 6x2.5
Drive Tray(s)	MCP-220-00127-0B-BULK	24	Black gen3 Hotswap 2.5 NVMe drive tray, Orange tab/Lock/Bulk
Parts	MCP-240-21733-0N	1	SC217BHF Bigtwin NVMe BPN retention bkt assy
Air Shroud	MCP-310-21719-0B	4	Bigtwin air shroud for X11DPT-BH (4CM fan chassis)
Riser Card	RSC-P-6	4	RSC-P-6 (1U LHS TwinPro RSC with 1 PCI-Ex16),RoHS
Riser Card	RSC-R1UTP-E16R	4	1U RHS TwinPro Riser card with one PCI-E x16 slot
Heatsink / Retention	SNK-P0067PS	4	1U Passive CPU Heat Sink for X11 Purley Platform Equipped with a Narrow Retention Mechanism
Heatsink / Retention	SNK-P0067PSM	4	1U Passive CPU Heat Sink with a 26-mm Wide Middle Air Channel for X11 Purley Platform Equipped with a Narrow Retention Mechanism
Power Supply	PWS-2K60A-1R	2	1U 1400W/2600W Redundant Titanium PWS, 45(W) X 40(H) X 480(L)

Parameters

Total amount of PCIe	5
CPU manufacturer	Intel
OCP/AIOM	0
Depth (mm)	630
2.5" Drive bays	16
3.5" Drive bays	0
HDD disks	16
NVMe slots	0
Socket	3647
Efficiency certification	Titanium
Size in U	2
Power (W)	1200

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