Supermicro PIO-229TP-HC0-NODE
A Node of SYS-6029TP-HC0R for RMA and Service only
We also offer six months of free collocation in our TIER III data center.
Components are not the end — ask us for a custom server configuration. We will design the server, assemble it, expertly set it up, and provide extended or NBD warranty.
Product code | 202.161615 |
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Part number | PIO-229TP-HC0-NODE |
Manufacturer | Supermicro |
Availability | Not in stock |
Warranty | 24 months |
Weight | 9 kg |
The price includes all legal fees |
Detailed information
Motherboard (Four per System) | |
Super X11DPT-PS |
Processor (per Node) | |
CPU |
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Cores |
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Note | * Please contact Supermicro Technical Support for supporting conditions of high power (TDP 150W and above) or high base frequency (3.0 GHz and above) processors. |
Note | *Processors ending N or S are optimized for networking and storage applications. Customer need POC their application and observe any thermal throttling before large deployment. |
Note | ‡ BIOS version 3.2 or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R) |
System Memory (per Node) | |
Memory Capacity |
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Memory Type |
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Note | † 2933MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro †† Cascade Lake only. Contact your Supermicro sales rep for more info. |
On-Board Devices (per Node) | |
Chipset |
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SAS |
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Network Controllers |
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IPMI |
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Graphics |
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Input / Output (per Node) | |
SAS |
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LAN |
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USB |
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VGA |
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Serial Port / Header |
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Others |
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System BIOS | |
BIOS Type |
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Management | |
Software |
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Power Configurations |
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PC Health Monitoring | |
CPU |
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FAN |
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Temperature |
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Omni-Path Fabric CPUs |
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Chassis | |
Form Factor |
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Model |
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Dimensions and Weight | |
Width |
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Height |
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Depth |
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Weight |
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Available Colors |
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Front Panel | |
Buttons |
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LEDs |
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Expansion Slots (per Node) | |
PCI-Express |
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Drive Bays (per Node) | |
Hot-swap |
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System Cooling | |
Fans |
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Power Supply | |
2200W Redundant Power Supplies with PMBus | |
Total Output Power and Input |
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AC Input Frequency |
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Dimension (W x H x L) |
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+12V |
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5VSB |
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Output Type |
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Certification | Titanium Level [ Test Report> ] |
Operating Environment | ||
RoHS |
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Environmental Spec. |
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Parts List - (Items Included) | |||
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Part Number |
Qty |
Description |
Motherboard / Chassis | MBD-X11DPT-PS
|
4
|
Super X11DPT-PS Motherboards
|
Backplane | BPN-ADP-S3008L-L6IP | 4 | LSI 3008, SAS 12Gbs (X6 port inside) |
Backplane | BPN-SAS3-217HQ2 | 1 | 2U 24-Port 4-Node Backplane Supports 6x2.5 |
Cable 1 | CBL-PWCD-0578 | 2 | PWCD,US,IEC60320 C14 TO C13,3FT,14AWG |
Air Shroud | MCP-310-21716-0B | 4 | Twinpro X11 air shroud |
Riser Card | RSC-P-6 | 4 | RSC-P-6 (1U LHS TwinPro RSC with 1 PCI-Ex16),RoHS |
Riser Card | RSC-R1UTP-UTP-E16R | 4 | 1U RHS TwinPro Riser card with one PCI-E x16 slot |
Heatsink / Retention | SNK-P0067PS | 4 | 1U Passive CPU Heat Sink for X11 Purley Platform Equipped with a Narrow Retention Mechanism |
Heatsink / Retention | SNK-P0067PSM | 4 | 1U Passive CPU Heat Sink with a 26-mm Wide Middle Air Channel for X11 Purley Platform Equipped with a Narrow Retention Mechanism |
Power Supply | PWS-2K20A-1R | 2 | 1U 2200W Redundant, Titanium, 76(W) X 40(H) X 336(L) mm |
Optional Parts List | |||
Part Number | Qty | Description | |
TPM security module (optional, not included) | AOM-TPM-9670V | 1 | SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor |
TPM security module (optional, not included) | AOM-TPM-9671V | 1 | SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor |
Add-on-Card | AOC-SMG3-2H8M2 | - | AOC supports 2280 M.2 form factor SSD (1 NVMe or 2 SATA), FST-SCRW-0121L is included in AOC-SMG3-2H8M2 |
Global Services & Support | OS4HR3/2/1
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-
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3/2/1-year onsite 24x7x4 service
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Software | SFT-OOB-LIC | 1 | OOB Management Package (per node license) |
Software | SFT-DCMS-Single | 1 | DataCenter Management Package (per node license) |