Storage Solutions

1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 1 PCI-E 3.0 x16 (FH, 10.5"L), 1 PCI-E 3.0 x8 (LP), 1 internal PCI-E 3.0 x16 (for SMCI storage controller) 4. Flexible networking options, up to 25GbE via Ultra Riser card

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24x DIMM slots 3. 2 PCI-E 3.0 x16, 3 PCI-E 3.0 x8, 1 PCI-E 2.0 x4 (in x8); Slot 3 & 4 occupied by controller and JBOD expansion port) 4. Quad 10GBase-T LAN w/ Intel® X540 5. 16x 3.5" Hot-swap SAS3/SATA3 drive bays; 2x 2.5" optional Hot-swap SATA drive bays (rear) 6. Hardware RAID controller and JBOD Expansion; RAID 0, 1, 5, 6, 10, 50, 60 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 2x 80mm hot-swap rear exhaust PWM fans 9. 920W Redundant Power Supplies Platinum Level (94%)

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 3. 1x PCI-E 3.0 x16, 6x PCI-E 3.0 x8

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots

1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 2 PCI-E 3.0 x16 (FHHL) slots, 1 PCI-E 3.0 x4 (LP) slot

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16 DIMM slots 3. 1 PCI-E 3.0 x16 HHHL slot, 1 PCI-E 3.0 x8 HHHL slot, 1 SIOM slot 4. Dual port 10GBase-T (Intel® X540), Intel® XL710 used for dedicated heartbeat between 2 nodes in SBB 5. 20 Hot-swap 2.5" dual port NVMe drive bays 6. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 7. 5 high-performance 8cm PWM fans 8. 2000W Redundant Power Supplies Titanium Level (96%)

Dual AMD EPYC™ 7002 Series Processors 8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs Expansion slots: 1 PCI-E 4.0 x16 slot (FH, 9.5" L) [Details] Integrated IPMI 2.0 + KVM with dedicated LAN Dual-port 10GBase-T and Dual-port 10G SFP+ via Intel® X710-TM4

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 4. 60 Hot-swap 3.5" SAS3/SATA3 drive bays with SES3; 2 rear Hot-swap 2.5" drive bays 5. Broadcom 3008 SAS3, IT mode 6. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 7. 5 Hot-swap 8cm rear exhaust PWM fans 8. 2000W Redundant Power Supplies Titanium Level (96%)

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24x DIMM slots 3. 2x PCI-E 3.0 x16 (2x FH, 10.5" L), 1x PCI-E 3.0 x8 (LP) slots 4. 4x 10GBase-T ports 5. 24x NVMe Hot-swap 2.5" drive bays (4 Hybrid ports - optional SAS3 supported via AOC); 2x rear SATA3 Hot-swap 2.5" drive bays 6. 4x heavy duty fans w/ optimal fan speed control 7. 1600W High efficiency (96%) Redundant PSU; Titanium Level

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 2 & 3 occupied by controller and JBOD expansion port)

1. Dual Node (HA), Enterprise High Availability (SBB) Architecture (shared storage); Fully serviceable and redundant Two hot-pluggable systems (nodes) in a 4U form factor. Each node supports the following: 2. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 3. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 4. 2 PCI-E 3.0 x16 (HHHL), 1 PCI-E 3.0 x8 (HHHL) 5. 90x 3.5"/2.5" Hot-swap SAS3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 22110) 6. Dual Broadcom 3616 IT Mode 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 9. 2600W Redundant Power Supplies Titanium Level (96%) 10. Dedicated node to node connectivity featuring high performance NTB PCI-E 3.0 x16 , 1G private Ethernet, and IPMI for robust node fail-over support