Motherboards

12th Generation Intel® Core™ i3/i5/i7/i9 Processors, Single Socket LGA-1700 supported, CPU TDP supports Up to 125W TDP Intel® W680 2 PCI-E 5.0 x16 slots (16/NA or 8/8)2 PCI-E 3.0 x4 1 - 5V PCI 32bit M.2 Interface: 3 PCI-E 4.0 x4, RAID 0 & 1

8th Generation Intel® Core™ i3 Processors, Intel® Celeron®, Intel® Pentium®, Intel® Xeon® E processor (Coffee Lake-S) Server, Intel® Xeon® E processor (Coffee Lake-S) Workstation., Single Socket H4 (LGA 1151) supported, CPU TDP support Up to 95W TDP Intel® C246 Up to 64GB Unbuffered ECC/non-ECC UDIMM, DDR4-2666MHz, in 4 DIMM slots 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 (in x16 slot), 1 PCI-E 3.0 x4, 1 PCI-E 3.0 x1, 2 PCI-Ex16 slots are running at NA/16, or 8/8 1 PCI, 1 - 5V PCI 32bit M.2 Interface: 2 PCI-E 2.0 x4, RAID 0 & 1 M.2 Form Factor: 22110 M.2 Key: M-Key M.2#1~2 are shared with SATA #6~7, M.2#2 is shared with U.2 U.2 Interface: 1 PCI-E 3.0 x4 1 HDMI port, 1 DVI - I port, 1 DP (DisplayPort) port, HDMI is HDMI2.0a, DP is DP1.2, Intel® C246 controller for 8 SATA3 (6 Gbps) ports; RAID 0,1,5,10 Single LAN with Intel® Ethernet Controller I210-AT Single LAN with Intel® PHY I219LM LAN controller Support vPro

Intel® Xeon® Scalable Processors, Single Socket P (LGA 3647) supported, CPU TDP support 165W Intel® C621 Chipset Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8x DIMM slots

12th Generation Intel® Core™ i9/i7/i5/i3/Pentium/Celeron Processor, Single Socket LGA-1700 supported, CPU TDP supports Up to 125W TDP Intel® R680E Up to 128GB Unbuffered ECC/non-ECC UDIMM, DDR5-4000MHz, in 4 DIMM slots 1 PCI-E 5.0 x16 slot, 2 PCI-E 4.0 x4 slots

Standard Design For mATX, ATX, and eATX Motherboards Compatible With Various X10DA series motherboards High Quality Anti-Rust Material Supermicro Certified

4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E), CPU TDP supports up to 350W TDP Intel C741® Chipset Up to 2TB 3DS ECC RDIMM, DDR5-4800MT/s (1DPC) in 8 DIMM slots 2 MCIO (PCIe5.0 x8) connectors for 4 NVMe SSDs 3 PCIe 5.0 x8, 2 PCIe 5.0 x16

Intel® Xeon® Scalable Processors, Single Socket P (LGA 3647) supported, CPU TDP support 165W Intel® C622 chipset Up to 768GB ECC 3DS LRDIMM, up to DDR4-2666MHz; 6x DIMM slots

1. Intel® Atom processor C2758, SoC, FCBGA 1283, 20W 8-Core 2. Up to 64GB DDR3 1600MHz ECC SO-DIMM in 4 DIMM sockets 3. Quad GbE LAN ports 4. IPMI with dedicated LAN 5. 2x SATA3 and 4x SATA2 ports 6. 1x PCI-E 2.0 x8 slot

1xSKT AM4, AMD Ryzen, X470, 6xSATA, 2xM.2, 2xGbE, IPMI

2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Single Socket P (LGA 3647) supported, CPU TDP support 205W Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots Intel® C622 chipset

1. Intel® C236 chipset 2. Up to 64GB Unbuffered ECC UDIMM DDR4 2400MHz; 4 DIMM slots 3. Expansion slots: 1 PCI-E 3.0 x8 (in x16), 1 PCI-E 3.0 x8, 2 PCI-E 3.0 x4 (in x8)

1U I/O Shield for X9DB3 with EMI Gasket,RoHS/REACH