3rd Gen Intel® Xeon® Scalable Processors – “Ice Lake”
GIGABYTE servers and Intel Xeon Scalable Processors deliver incredible 1P/2P performance from edge to data center with incredible gains in I/O throughput and workload demands that need high performing CPUs with large, yet optimized, memory configurations.
Servers
GIGABYTE Builds
Rackmounts
Max I/O Systems
Network Server
GIGABYTE R282-G30 (rev. 100) - 6NR282G30MR-00-1T
GIGABYTE R282-G30 (rev. 100) - 6NR282G30MR-00-1T
Supports up to 3 x Dual slot GPU cards NVIDIA-Certified system for scalability, manageability, security, and performance 3rd Gen Intel® Xeon® Scalable Processors Dual processor, LGA 4189 8-Channel RDIMM/LRDIMM DDR4 per processor, 32 x DIMMs Supports Intel® Optane™ Persistent Memory 200 series Dual ROM Architecture Intel® C621A Chipset 2 x 1Gb/s LAN ports (Intel® I350-AM2) 1 x Dedicated management port 4 x 3.5"/2.5" Gen4 NVMe/SATA/SAS hot-swappable bays 8 x 3.5"/2.5" SATA/SAS hot-swappable bays 5 x FHFL PCIe Gen4 x16 slots 1 x OCP 3.0 Gen4 x16 slot 1 x OCP 2.0 Gen3 x8 mezzanine slot 1+1 2400W (240V) 80 PLUS Titanium redundant power supplies
We also offer six months of free collocation in our TIER III data center.
Components are not the end — ask us for a custom server configuration. We will design the server, assemble it, expertly set it up, and provide extended or NBD warranty.
| Product code | 202.166091 |
|---|---|
| Part number | 6NR282G30MR-00-1T |
| Manufacturer | GIGABYTE |
| Availability | Not in stock |
| Warranty | 24 months |
| Weight | 20 kg |
| The price includes all legal fees | |
Detailed information
Enhanced I/0
Support for PCIe 4.0 allows for double the throughput of PCIe 3.0 for fast and large data transfers. Also, 64 lanes per socket with up to 128 lanes in a 2P configuration for fast data transmission from CPU to GPU, accelerator or storage.
CPU Performance Boost
Now up to 40 cores per socket with greatly improved IPC on Intel’s 10nm architecture while operating CPUs at 105-270W. Also, an additional UPI lane is added for up to 11.2GT/s for a low latency interconnect between CPUs.
Next Gen Memory
Each processor provides eight memory channels to support 8 or 16 DIMM slots with up to DDR4-3200. There are two sub-clustering modes, Sub NUMA (SNC) and Hemisphere (HEMI), available using balanced memory that results in performance improvements. Additionally, support for Intel Optane PMem 200 series provides two modes for greater memory capacity and data persistence to process large amounts of data faster.
Next Level Security
New instructions and architecture deliver a high level of cryptographic operations for data privacy and protection. Cryptographic accelerators speed up encryption protocols as well as improvements in software guard extensions and memory encryption are added.
AI Acceleration
AI inference and training are enhanced with DL Boost Technology for greater business, operational, and security insights. Applications include HPC, AI, and Media & Graphics.
Accelerator Computing
Support 3 GPU cards and keep 2 FHFL AIC
Parallel processing with multiple GPUs are driving discoveries and powering AI and data analytics. Offering support for dual slot GPUs allows for the highest, dense GPU compute possible. Delivering the fastest throughput for data, PCIe Gen 4 lanes are all in x16 mode for a total bandwidth of 64GB/s per GPU.
Flexibility
Mixed storage for HDD capacity or SSD cache
GIGABYTE servers have incorporated a high level of flexibility. Servers can accommodate large capacity power supplies to support demanding processors. As well, mixed drives allow for varying form factors and storage speed protocols. Various expansion slots to house dual slot GPU cards or other accelerators, with additional options for NICs and OCP solutions.
Availability
Dual ROM ensure server operate independently
Downtime is not a word wanted to be heard in IT. The ability to have stable and continuous server operation is crucial for business operations. Steps have been taken with redundant PSUs, hot-swap drives, dual ROM, and fault tolerances to ensure GIGABYTE servers operate independently from anywhere.
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- Dimensions
Form Factor 2U WxHxD, mm 438 x 87.5 x 730 - Motherboard
Part number MR92-FS1 - CPU
Model 3rd Generation Intel® Xeon® Scalable Processors Technology Dual processor, 10nm technology TDP up to 270W - Socket and Chipset
Socket 2 x LGA 4189, Socket P+ Chipset Intel® C621A Chipset - Memory
Slots 32 x DIMM Memory architecture 8-channel RDIMM modules up to 128GB supported LRDIMM modules up to 128GB supported 3DS RDIMM/LRDIMM modules up to 256GB supported 1.2V modules 3200/2933/2666 MT/s - LAN
Rear side 2 x 1Gb/s LAN ports (Intel® I350-AM2) Support NCSI function Yes Management LAN 1 x 10/100/1000 Mbps - Video
Integrated in Aspeed® AST2600 PCIe bus interface 2D Video Graphic Adapter Resolution 1920x1200@60Hz 32bpp
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- Storage
4 x 3.5"/2.5" Gen4 NVMe/SATA/SAS hot-swappable bays 8 x 3.5"/2.5" SATA/SAS hot-swappable bays SAS card required for SAS devices support - Expansion Slots
Riser Card CRS2014 1 x PCIe x16 (Gen4 x16) FHFL slot, from CPU_1, for GPUs Riser Card CRS2026 x 2 2 x PCIe x16 (Gen4 x16) FHFL slots, from CPU_0, for GPUs - Backplane Board
Speed and bandwidth PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s - TPM
TPM header SPI interface Optional TPM2.0 kit CTM010 - Power Supply
Certification 80 PLUS Titanium redundant Power 2400W QTY 1+1 - Fans
System 4 x 80x80x38mm (16,300rpm) - Packaging
Dimensions 982 x 588 x 268 mm
Parameters
| Size in U | 2 |
|---|---|
| Depth (mm) | 730 |
| CPU manufacturer | Intel |
| Socket | 4189 |
| HDD disks | 12 |
| 2.5" Drive bays | 0 |
| 3.5" Drive bays | 12 |
| NVMe slots | 4 |
| Total amount of PCIe | 5 |
| OCP/AIOM | 1 |
| Power (W) | 2700 |
| Efficiency certification | Titanium |
