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Servers GIGABYTE Builds Rackmounts Mainstream GIGABYTE R163-S35 (rev. AAH1) - 6NR163S35DR000ABH1

GIGABYTE R163-S35 (rev. AAH1) - 6NR163S35DR000ABH1

Single 5th/4th Gen Intel® Xeon® Scalable Processors Single Intel® Xeon® CPU Max Series 8-Channel DDR5 RDIMM, 16 x DIMMs Dual ROM Architecture 1 x 1Gb/s LAN port via Intel® I210-AT 12 x 2.5" Gen5 NVMe/SATA/SAS-4 hot-swappable bays 1 x M.2 slot with PCIe Gen3 x4 interface 1 x FHHL PCIe Gen5 x16 slot 1 x OCP 3.0 Gen5 x16 slot 1+1 1300W 80 PLUS Titanium redundant power supplies

We also offer six months of free collocation in our TIER III data center.

Components are not the end — ask us for a custom server configuration. We will design the server, assemble it, expertly set it up, and provide extended or NBD warranty.

Product code 202.181161
Part number 6NR163S35DR000ABH1
Manufacturer GIGABYTE
Availability Not in stock
Warranty 36 months
Weight 51 kg
The price includes all legal fees
€ 2 428,06 ex VAT
€ 2 428,06 w/ VAT
pc

Detailed information

Rack servers

Highly flexible, scalable rack servers optimized for demanding applications in data centers. Rack density from 1U to 5U, servers are designed for single and multi-socket varieties of x86 processors from AMD and Intel as well as for ARM processors from Ampere.

Applications Include

Big Data

High Performance Computing (HPC)

Hyper-converged infrastructure (HCI)

Software-defined Storage (SDS)

Virtualization

Only the best with GIGABYTE

Strong R&D and forward ideas to deliver the values that can help you succeed in the future.

High Performance

Servers and motherboards by GIGABYTE are tested to ensure peak performance for demanding CPU workloads. All the latest technology is supported.

Compute Density

One single socket solution can outperform many dual CPU servers. Dual socket models also support up to hundreds of cores in a 1U-5U chassis. More compact performance.

Fast & Stable Connectivity

Keeping pace with the challenges for next gen technology, well designed GIGABYTE boards provide users the signal integrity for newest PCIe generation.

Modularity

Building block designs allow new models to quickly reach the market. Users can now have BMC on a OCP module customized by GIGABYTE.

Collaboration

GIGABYTE and its partners have maintained a healthy relationship that values shared knowledge in order to get the latest technology into data centers.

Optimal Price

A broad portfolio of servers and products allows customers to only select the features they require which results in a lower total cost of ownership (TCO).

Edge Server

Real-time data processing at the source reduces latency for real-time analytics, IoT, and 5G networks. These servers are deployed in compact locations and are designed to continue running even when internet connection is lost.

Dimensions
Form Factor 1U
Server Dimensions( WxHxD ) 438 x 43.5 x 710 mm
Packaging Dimensions 977 x 588 x 236 mm
Motherboard
Part Name MS33-DC0
Processor
CPU 5th Generation Intel® Xeon® Scalable Processors
4th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
Socket LGA 4677
QTY 1
Chipset Intel C741
System Memory
Memory Type RDIMM
DDR5
Memory Speed 5th Gen Intel® Xeon®: Up to 5600 MT/s (1DPC), 4400 MT/s (2DPC)
4th Gen Intel® Xeon®: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)
Intel® Xeon® Max Series: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)

5600 MT/s support under 2DPC configuration requires verified memory and BIOS setup. Please refer to the QVL for more information.
Memory Slots 16
Storage
Disk Bays Front side:
12 x 2.5" Gen5 NVMe/SATA/SAS-4 hot-swappable bays

SAS card is required to enable the drives
Input / Output
LAN Rear side:
1 x 1Gb/s LAN port (1 x Intel® I210-AT)
Supports NCSI function

1 x 10/100/1000 Mbps Management LAN
Video 2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
Backplane Board
Backplane Board PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s
Security Modules
TPM 1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010
Power Supply
Certification 80 PLUS Titanium
Power 1300W
QTY 1+1
Environment Properties
Operating Temperature:
10°C to 35°C

Humidity:
8%-80%
(non-condensing)
Non-operating Temperature:
-40°C to 60°C

Humidity:
20% to 95%
(non-condensing)

Parameters

Size in U 1
Depth (mm) 710
CPU manufacturer Intel
Socket 4677
HDD disks 13
2.5" Drive bays 12
3.5" Drive bays 0
NVMe slots 12
Total amount of PCIe 1
OCP/AIOM 1
Power (W) 1300
Efficiency certification Titanium

Price development



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