GIGABYTE MZ72-HB0 - 9MZ72HB0MR-00
Dual AMD EPYC™ 7002 series processor family 8-Channel RDIMM/LRDIMM DDR4 per processor, 16 x DIMMs 2 x 10Gb/s BASE-T LAN ports (Broadcom® BCM57416) 1 x Dedicated management port 4 x 7-pin SATA 6Gb/s ports 3 x SlimSAS (with 12 x SATA 6Gb/s or 3 x NVMe PCIe Gen4 x4) ports 2 x SlimSAS (with 2 x NVMe PCIe Gen4 x4) ports 1 x Ultra-Fast M.2 with PCIe Gen4 x4 bandwidth Up to 5 x PCIe Gen4 slots
We also offer six months of free collocation in our TIER III data center.
Components are not the end — ask us for a custom server configuration. We will design the server, assemble it, expertly set it up, and provide extended or NBD warranty.
Product code | 200.168437 |
---|---|
Part number | 9MZ72HB0MR-00 |
EAN | 4719331809751 |
Manufacturer | GIGABYTE |
Availability | Not in stock |
Warranty | 24 months |
Weight | 0 kg |
The price includes all legal fees |
Detailed information
AMD EPYC™ 7003 Processors with AMD 3D V-Cache™
AMD EPYC 7003 Series Processors with AMD 3D V-Cache™ technology are raising the bar once more for breakthrough performance on targeted technical computing workloads like Electronic Design Automation, Computational Fluid Dynamics, and Finite Element Analysis software and solutions. Delivering breakthrough performance per core and performance per watt, the Zen 3 architecture maintains leadership in number of cores – up to 64, amount of L3 cache – 768MB, and 128 PCIe 4.0 lanes, while maintaining socket compatibility with existing 3rd Gen AMD EPYC platforms.
Optional TPM 2.0 Module
For hardware-based authentication, the passwords, encryption keys, and digital certificates are stored in a TPM module to prevent unwanted users from gaining access to your data. GIGABYTE TPM modules come in either a Serial Peripheral Interface or Low Pin Count bus.
Certified Ready with Software Partners
Being a member of key software alliance partner programs enables GIGABYTE to rapidly develop and validate joint solutions, enabling our customers to modernize their data centers and implement IT infrastructure and application services with speed, agility, and cost optimization.
Form Factor |
E-ATX |
CPU |
AMD EPYC™ 7003 processors with AMD 3D V-Cache™ Technology |
Socket |
Socket SP3 |
Chipset |
System on Chip |
Memory |
16 x DIMM slots |
LAN |
2 x 10GbE BASE-T LAN ports (1 x Broadcom® BCM57416) |
Video |
Integrated in Aspeed® AST2500 |
Audio |
N/A |
SAS |
N/A |
SATA |
4 x 7-pin SATA 6Gb/s ports |
RAID |
N/A |
Expansion Slots |
Slot_6: 1 x PCIe x16 (Gen4 x16 bus) slot ( from CPU_0) |
Internal I/O |
1 x 24-pin ATX main power connector |
Rear I/O |
2 x USB 3.0 |
TPM |
1 x TPM header with SPI interface |
OS Compatibility |
Windows Server 2016 ( X2APIC/256T not supported) |
Board Management |
Aspeed® AST2500 management controller |
PSU Connectors |
1 x 24-pin ATX main power connector |
Operating Properties |
Operating temperature: 10°C to 40°C |
Retail Packaging Content |
1 x MZ72-HB0 |
Bulk Packaging Content |
10 x MZ72-HB0 |
Reference Numbers |
Retail: 9MZ72HB0MR-00 PCB Rev. 3.0 |
Parameters
Dimensions | 12" x 13" |
---|---|
CPU manufacturer | AMD |
Socket | SP3 |
Processor generation | AMD 7000 |
Number of CPUs | 2 |
Max. DIMM slots | 16 |
Max. frequency | 3200 MHz |
Internet connector | RJ45 |
NIC speed in Gbps | 10 Gb |
M.2 count | 1 |
DVI port | No |
VGA port | Yes |
HDMI port | No |
TDP (W) | 280 |
Processor series |