BigTwin

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16 (LP) slot; 1 SIOM card support (flexible networking)

Socket P+ (LGA 4189) support 3rd Gen Intel® Xeon® Scalable processors Intel® C621A 20 DIMMs; Up to 6TB DDR4-3200: Intel® Optane™ Persistent Memory 200 Series; Up to 4TB ECC DDR4-3200: RDIMM 1 PCI-E 3.0 x8 M.2 NVMe Boot Controller via AOC-SMG3-2M2-B 2 PCI-E 4.0 x16 (LP) slot Network connectivity via AIOM (OCP 3.0 compliant) 3 Hot-swap 3.5" drive bays; 3 NVMe/SAS/SATA 3.5"; 2 M.2 NVMe OR 2 M.2 SATA3 Shared cooling design with 4 heavy duty fans with optimal fan speed control; 4 Air Shroud(s) 2600W Redundant Power Supplies Titanium Level (96%+); Shared Power Design

Socket P+ (LGA 4189) support 3rd Gen Intel® Xeon® Scalable processors Intel® C621A 20 DIMMs; Up to 6TB DDR4-3200: Intel® Optane™ Persistent Memory 200 Series; Up to 4TB ECC DDR4-3200: RDIMM 1 PCI-E 3.0 x8 M.2 NVMe Boot Controller via AOC-SMG3-2M2-B 1 PCI-E 4.0 x16 (LP) slot; 2 PCI-E 4.0 x8 (LP) slot Network connectivity via AIOM (OCP 3.0 compliant) 12 Hot-swap 2.5" drive bays; 12 NVMe/SATA 2.5"; 2 M.2 NVMe OR 2 M.2 SATA3 Dedicated cooling zones with heavy duty fans with optimal fan speed control (2 fans per node); 2 Air Shroud(s) 2200W Redundant Power Supplies Titanium Level (96%+); Shared Power Design