ASRock - 2U24E-GENOA2
2U Rackmount with 1+1, 80-PLUS Titanium, 2600W CRPS Dual Socket SP5 (LGA 6096), supports AMD EPYC™ 9004 (with AMD 3D V-Cache™ Technology) and 97x4 series processors 12+12 DIMM slots (1DPC), supports DDR5 RDIMM, RDIMM-3DS 24 hot-swap 2.5" NVMe (PCIe4.0 x4) drive bays 2 fixed 2.5" NVMe (PCIe5.0 x4) drive bays 1 FHHL PCIe4.0 x16 or 2 FHHL PCIe4.0 x8 1 FHHL PCIe4.0 x16 or 2 FHHL PCIe4.0 x8 1 HHHL PCIe4.0 x8 Supports 2 M.2 (PCIe3.0 x4) 2 RJ45 (1GbE) by Intel® i350 1 OCP NIC 3.0 (PCIe5.0 x16) Remote Management (IPMI)
We also offer six months of free collocation in our TIER III data center.
Components are not the end — ask us for a custom server configuration. We will design the server, assemble it, expertly set it up, and provide extended or NBD warranty.
Product code | 202.170090 |
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Part number | 2U24E-GENOA2 |
Manufacturer | AsRock |
Availability |
In stock 0 pc
Stock allocation and delivery options
Transport company across Europe Wednesday 27. 11. at the latest Tuesday 3. 12. |
Supplier availability | In stock 2 pc |
Warranty | 36 months |
Weight | 20 kg |
The price includes all legal fees |
Detailed information
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- System
Form Factor 2U Rackmount Dimensions 770.0 x 438.0 x 86.4 mm (30.3'' x 17.2'' x 3.4'') Support MB GENOA2D24TM3-2L+ - Front Panel
Buttons Power, Reset, UID LEDs Power, LAN 1/2, HDD Activity, System status I/O Ports 1 Type-A (USB3.2 Gen1), 1 Type-A (USB2.0), 1 DB15 (VGA) - External Drive Bay / Storage
Front Side Drive Bay 24 hot-swap 2.5" NVMe (PCIe5.0 x4) drive bays Front Side Backplane Three 8-port NVMe passive backplanes Rear Side 2 fixed 2.5'' NVMe (PCIe5.0 x4) drive bays Internal Side 1 M-key (PCIe3.0 x4), supports 2280/2260/2242/2230 form factor [CPU0]1 M-key (PCIe3.0 x4), supports 2280/2242 form factor [CPU1] - Power Supply
Type 1+1 CRPS Output Watts 1000W @ 100-127Vac input / 2600W @ 220-240Vac input Efficiency 80-PLUS Titanium AC Input Low-line: 100-127Vrms, 50/60Hz ; High-line: 220-240Vrms, 50/60Hz - System Fan
Fan 6 PWM hot-swap 60x38 mm fans - Processor System
CPU Supports AMD EPYC™ 9004 (with AMD 3D V-Cache™ Technology) and 97x4 series processors Socket Dual Socket SP5 (LGA 6096) Thermal Design Power Up to 300W Chipset System on Chip - System Memory
Supported DIMM Quantity 12+12 DIMM slots (1DPC) Supported Type Supports DDR5 288-pin RDIMM, RDIMM-3DS Max. Capacity per DIMM RDIMM: 96GB (2R)
RDIMM-3DS: 512GB (2S8Rx4)Max. DIMM Frequency 4800 MHz Voltage 1.1V - PCIe Expansion Slots (SLOT7 close to CPU)
PCIe x 16 Rear:
1 FHHL PCIe5.0 x16 or 2 FHHL PCIe5.0 x8
1 FHHL PCIe5.0 x16 or 2 FHHL PCIe5.0 x8
1 HHHL PCIe5.0 x8
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- Ethernet
Additional GbE Controller Intel® i350: 2 RJ45 (1GbE) OCP slot 1 OCP NIC 3.0 (PCIe5.0 x16) [CPU1] - Server Management
BMC Controller ASPEED AST2600 IPMI Dedicated GLAN 1 Realtek RTL8211F for dedicated management GLAN - Rear I/O
UID Button/LED 1 UID button w/ LED VGA Port 1 DB15 (VGA) Serial Port 1 RJ45 (COM) USB 3.2 Gen1 Port 2 Type-A (USB3.2 Gen1) RJ45 2 RJ45 (1GbE)
1 dedicated IPMI- System BIOS
BIOS Type AMI UEFI BIOS; 256 Mb (32MB) SPI Flash ROM BIOS Features ASRock Rack Instant Flash, ACPI 6.4 and abouve compliance wake up events, SMBIOS 3.5.0 and above, Plug and Play(PnP) - Monitor
Temperature CPU, MB, Card side Temperature Sensing Fan Fan Tachometer
CPU Quiet Fan (Allow Chassis Fan Speed Auto-Adjust by CPU Temperature)
Fan Multi-Speed ControlVoltage P0_VDDCR_CPU0, P0_VDDCR_CPU1, P0_VDDCR_SOC, P0_VDD_18_DUAL, P0_VDD_11_S3, P0_VDDIO, P1_VDDCR_CPU0, P1_VDDCR_CPU1, P1_VDDCR_SOC, P1_VDD_18_DUAL, P1_VDD_11_S3, P1_VDDIO, +BAT, +12V, +3VSB, +5VSB - Environment
Temperature Operation temperature: 10°C ~ 35°C / Non operation temperature: -40°C ~ 70°C Humidity Non operation humidity: 20% ~ 90% ( Non condensing) - Graphics
Controller ASPEED AST2600 VRAM DDR4 512MB
Parameters
Size in U | 2 |
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Depth (mm) | 770 |
CPU manufacturer | AMD |
Socket | SP5 |
HDD disks | 52 |
2.5" Drive bays | 26 |
3.5" Drive bays | 0 |
NVMe slots | 50 |
Total amount of PCIe | 5 |
OCP/AIOM | 1 |
Power (W) | 2600 |
Efficiency certification | Titanium |